Follow Slashdot blog updates by subscribing to our blog RSS feed

 



Forgot your password?
typodupeerror
Slashdot Deals: Prep for the CompTIA A+ certification exam. Save 95% on the CompTIA IT Certification Bundle ×
The Internet

Submission + - DARPA wants electronics with radically novel liquid cooling technology ->

coondoggie writes: "With increased electronic minituriztion and the density of the chips running such devices heat is a mortal enemy for the power and scalability of such systems. DARPA today announced a program called Intrachip/Interchip Enhanced Cooling (ICECool) that it hopes will go the heart of such heat problems by building chips with a drastically different way of cooling that uses what the agency calls a microfluid channel inside the chip or component that will more effectively dissipate heat than current cooling technologies."
Link to Original Source
This discussion was created for logged-in users only, but now has been archived. No new comments can be posted.

DARPA wants electronics with radically novel liquid cooling technology

Comments Filter:

Nothing succeeds like the appearance of success. -- Christopher Lascl

Working...